FPD / Semiconductor

  ● For FPD glass cleaning purpose

  ● For film removal and substrate cleaning after the etching process

  ● Equipment configuration specifications: Film delamination Zone, Loader, Rinsing Zone, Air Knife Zone, Unloader

  ● Substrate size: User request specification

  ● Tact : User request specifications

  ● Program configuration: PLC and PC control

  ● Air Knife Zone: Single, double, hot air nozzle configuration available

  ● Rinsing Zone : Water jet, CO₂ bubbler

  ● Water used for cleaning can be selected to use circulating water or new liquid

  ● Cleaner, Delamination Cleaner, SP Cleaner, Water Jet